Microstructural Characterization of Cofired Tungsten-Metallized High-Alumina Electronic Substrates-Reference-Cited by-同舟云学术

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Microstructural Characterization of Cofired Tungsten-Metallized High-Alumina Electronic Substrates

Published:1992-10 Issue:10 Volume:75 Page:2815-2824
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:J American Ceramic Society

Author:

Behrens Gesa,Heuer Arthur H.

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1992.tb05510.x/fullpdf

Reference42 articles.

1. 1R. R. Tummala, and E. J. Rymaszewski , Microelectronics Packaging Handbook ; pp.455 522 . Van Nostrand Reinhold, New York, 1989 .

2. High-Temperature Metallizing of Alumina

3. High-temperature metallizing

4. Refractory metallization of green ceramic

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3. Characterization of Metallized Alumina Ceramics;Metallurgical and Materials Transactions A;2011-10-12

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