High-Temperature Failure Mechanisms of Hot-Pressed Si3N4 and Si3N4/Si3N4-Whisker-Reinforced Composites
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1993.tb03764.x/fullpdf
Reference17 articles.
1. Tensile and creep strengths of hot-pressed Si3N4
2. Crack propagation and failure prediction in silicon nitride at elevated temperatures
3. High-Temperature Strength Behavior of Hot-Pressed Si3N4: Evidence for Subcritical Crack Growth
4. The structure of slow crack interfaces in silicon nitride
5. Displacement Rate and Temperature Effects in Fracture of a Hot-Pressed Silicon Nitride at 1100° to 1325°C
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