Displacement Rate and Temperature Effects in Fracture of a Hot-Pressed Silicon Nitride at 1100° to 1325°C
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1984.tb19538.x/fullpdf
Reference24 articles.
1. High Temperature Creep of Silicon-Base Compounds;Seltzer;Am. Ceram. Soc. Bull.,1977
2. Compressive Creep of Si3N4/MgO Alloys. Part 1. Effect of Composition;Lange;J. Mater. Sci.,1980
3. Creep of Hot-Pressed Silicon Nitride;Din;J. Mater. Sci.,1975
4. Tensile and Creep Strengths of Hot-Pressed Si3N4;Kossowsky;J. Mater. Sci.,1975
5. Creep and Strain Recovery in Hot-Pressed Silicon Nitride;Arons;J. Mater. Sci.,1980
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