Effect of Substrate Orientation, Roughness, and Film Deposition Mode on the Tensile Strength and Toughness of Niobium-Sapphire Interfaces
Author:
Publisher
Wiley
Subject
Materials Chemistry,Ceramics and Composites
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.1997.tb03246.x/fullpdf
Reference19 articles.
1. Measurement of Interface Strength by Laser Spallation Experiment;Gupta;J. Mech. Phys. Solids,1990
2. Measurement of Interface Strength by Laser Pulse Produced Spallation;Gupta;Mater. Sci. Eng. A,1990
3. Measurement of Interface Strength by the Modified Laser Spallation Technique. Part I: Experimental Technique and Modeling the Spallation Process;Yuan;J. Appl. Phys.,1993
4. Measurement of Interface Strength by Orientation, the Modified Laser Spallation Technique. Part II;Gupta;J. Appl. Phys.,1993
5. Measurement of Interface Strength by the Modified Laser Spallation Technique. Part III;Yuan;J. Appl. Phys,1993
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