In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique-Reference-Cited by-同舟云学术

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In-situ measurement of solder joint strength in board-mounted chip-scale packages using a quantitative laser spallation technique

Published:2013-04 Issue:7 Volume:27 Page:719-730
ISSN:0169-4243
Container-title:Journal of Adhesion Science and Technology
language:en
Short-container-title:Journal of Adhesion Science and Technology

Author:

Kim Hyoung Il,Tian Jun,Gupta Vijay

Publisher

Informa UK Limited

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Mechanics of Materials,General Chemistry

Link

http://www.tandfonline.com/doi/pdf/10.1080/10256018808623883

Reference22 articles.

1. Thermomechanical Fatigue Testing and Analysis of Solder Alloys

2. Fatigue Life Analysis of Solder Joints in Flip Chip Bonding

3. JEDEC Board Level Drop Test Method of Components for Handheld Electronic Products, JEDEC Standard JESD22-B111, 2003.

4. Chiu TC, Zeng K, Stierman R, Edwards D, Ano K. Effect of thermal aging on board level drop reliability for Pb-free BGA packages. Proceedings of Electronic Components and Technology Conference; Las Vegas, NV; 2004. p. 1256–62.

5. JEDEC BGA Ball Shear Test, JEDEC Standard JESD22-B117 2000.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Laser-driven shocks to explore the effects of aging on the adhesion of silver sintered on copper substrate;Journal of Adhesion Science and Technology;2021-09-02

2. On the shock-based determination of the adhesive strength at a substrate-coating interface;Journal of Adhesion Science and Technology;2017-05-26

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