Effect of Microstructure on High-Temperature Compressive Creep of Self-Reinforced Hot-Pressed Silicon Nitride-Reference-Cited by-同舟云学术

Effect of Microstructure on High-Temperature Compressive Creep of Self-Reinforced Hot-Pressed Silicon Nitride

Published:2000-12 Issue:12 Volume:83 Page:3065-3069
ISSN:0002-7820
Container-title:Journal of the American Ceramic Society
language:en
Short-container-title:

Author:

Boling-Risser Martha A.,Goretta K. C.,Routbort J. L.,Faber K. T.

Publisher

Wiley

Subject

Materials Chemistry,Ceramics and Composites

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1111/j.1151-2916.2000.tb01683.x/fullpdf

Reference27 articles.

1. 1. M. A. Boling-Risser , “The Effect of Microstructure on the High-Temperature Mechanical Behavior of a Self-Reinforced, Hot-Pressed Silicon Nitride”; Ph.D. Thesis. Northwestern University, Evanston, IL, 1998.

2. Evolution of Oxidation and Creep Damage Mechanisms in HIPed Silicon Nitride Materials

3. Evolution of Stress Failure Resulting from High-Temperature Stress-Corrosion Cracking in a Hot Isostatically Pressed Silicon Nitride;Wereszczak;J. Am. Ceram. Soc.,1995

4. Overview No. 28, High-Temperature Failure Initiation in Liquid Phase Sintered Materials;Marion;Acta Metall.,1983

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