Evolution of Oxidation and Creep Damage Mechanisms in HIPed Silicon Nitride Materials

Author:

Wereszczak Andrew A.,Ferber Mattison K.,Kirkland Timothy P.,More Karren L.

Publisher

Springer US

Reference7 articles.

1. A. A. Wereszczak, K. Breder, and M. K. Ferber, “Role of Oxidation in the Time-Dependent Failure Behavior of Hot Isostatically Pressed Silicon Nitride at 1370°C,” Journal of the American Ceramic Society, 76 [11] 2919–22 (1993).

2. I.S. Raju and J. C. Newman, Jr., “Stress Intensity Factors for Circumferential Surface Cracks in Pipes and Rods Under Tension and Bending Loads,” NASA Technical Memorandum, Report No. NASA TM-87594, 1985.

3. A. A. Wereszczak, T. P. Kirkland, K. Breder, M. K. Ferber, and P. Khandelwal, “High Temperature Dynamic Fatigue Performance of a Hot Isostatically Pressed Silicon Nitride,” In press Materials Science and Engineering.

4. Y. G. Gogotsi and G. Grathwohl, “Stress-Enhanced Oxidation of Silicon Nitride Ceramics,” Journal of the American Ceramic Society, 76 [12] 3093–104 (1993).

5. D. R. Clarke, “A Comparison of Reducing and Oxidizing Heat Treatments of Hot-Pressed Silicon Nitride,” Journal of the American Ceramic Society, 66 [2] 92–95 (1983).

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