Experimental Analysis of Thermo-mechanical Behaviour of Electronic Components with Speckle Interferometry

Author:

Casavola C.1,Lamberti L.1,Moramarco V.1,Pappalettera G.1,Pappalettere C.1

Affiliation:

1. Dipartimento di Meccanica, Matematica e Management; Politecnico di Bari; Viale Japigia 182 70126 Bari Italy

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

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