Experimental Analysis of Thermo-mechanical Behaviour of Electronic Components with Speckle Interferometry
Author:
Affiliation:
1. Dipartimento di Meccanica, Matematica e Management; Politecnico di Bari; Viale Japigia 182 70126 Bari Italy
Publisher
Wiley
Subject
Mechanical Engineering,Mechanics of Materials
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1111/str.12061/fullpdf
Reference43 articles.
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3. Solder ball connect (SBC) assemblies under thermal loading: I. deformation measurement via moiré interferometry and its interpretation;Guo;IBM J. Res. Dev.,1993
4. Multilayer diamond heat spreaders for electronic power devices;Jagganadham;Solid State Electron.,1998
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