Liquid Immersion Angled Exposure for 3D Photolithography
Author:
Affiliation:
1. Department of Advanced Science and Technology, Toyota Technological Institute
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
https://www.jstage.jst.go.jp/article/ieejsmas/136/3/136_90/_pdf
Reference5 articles.
1. (1) H. Morii, F. Oohira, T. Suzuki, K. Terao, M. Sasaki, T. Ochi, A. Yuzuriha, and K. Wani : “Proposal of High-Density Packaging Construction and Conductive Pattern Forming Method on Vertical Wall Using Spray Coating Technology”, IEEJ Trans. S. M. E131, pp. 40-44 (2011)
2. (2) S. Kumagai, N. Fukuda, H. Tajima, and M. Sasaki : “Improving Photoresist Spray Coating Using a Shield Plate with an Aperture toward Trench-type Three Dimensional Microdevices”, Jpn. J. Appl. Phys., 51, 02BL04 (2012)
3. (3) V. K. Singh, M. Sasaki, and K. Hane : “Angled Exposure Method for Pattering on Three-Dimensional Structures”, Jpn. J. Appl. Phys., 46, 9B pp. 6449-6453 (2007)
4. (4) T. Yamaguchi, M. Shibata, S. Kumagai, and M. Sasaki : “Thermocouples fabricated on trench sidewall in micro fl uidic channel bonded with film cover”, Jpn. J. Appl. Phys., 54, 030219 (2015)
5. (5) E. Hecht : “Optics”, 4th ed., Chap. 4, Pearson Education Inc. (2002)
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1. Light-absorbent liquid immersion angled exposure for patterning 3D samples with vertical sidewalls;Journal of Micromechanics and Microengineering;2017-01-13
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