Fabrication of Metallic Microneedle by Electroplating and Sharpening of it by Electrochemical Etching-Reference-Cited by-同舟云学术

Fabrication of Metallic Microneedle by Electroplating and Sharpening of it by Electrochemical Etching

Published:2011 Issue:11 Volume:131 Page:373-380
ISSN:1341-8939
Container-title:IEEJ Transactions on Sensors and Micromachines
language:en
Short-container-title:IEEJ Trans. SM

Author:

Huang Chih-hao¹,Tanaka Takahiro¹,Takaoki Yutaka¹,Izumi Hayato²,Takahashi Tomokazu¹,Suzuki Masato¹,Aoyagi Seiji¹

Affiliation:

1. Kansai University

2. Nagoya Institute of Technology

Publisher

Institute of Electrical Engineers of Japan (IEE Japan)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://www.jstage.jst.go.jp/article/ieejsmas/131/11/131_11_373/_pdf

Reference21 articles.

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2. A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array

3. (3) P. Griss, P. Enoksson, K. T. Laakso, P. Merilainen, S. Ollmar, and G. Stemme : “Spiked biopotential electrodes”, Proc. MEMS'00, pp. 323-328 (2000)

4. (4) M. Shikida, M. Ando, Y. Ishihara, N. Yamaura, T. Ando, K. Sato, and K. Asaumi : “Fabrication of Pen-Shaped Microneedle Structure by using Non-Photolithographic Pattern Transfer”, Proc. Transducers'03, pp. 1671-1674 (2003)

5. (5) D. V. McAllister, F. Cross, S. P. Davis, L. M. Matta, M. R. Prausnitz, and M. G. Allen : “Three-Dimensional Hollow Microneedle and Microtube Arrays”, Proc. Transducers '99, pp. 1098-1101 (1999)

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