Microfabrication Technology for Millimeter-Wave Photonic Systems on Si
Author:
Affiliation:
1. NTT Microsystem Integration Labs.
2. HRL laboratories
3. NTT Advanced Technology Corp.
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
http://www.jstage.jst.go.jp/article/ieejsmas/124/4/124_4_136/_pdf
Reference19 articles.
1. (1) H. Ishii, S. Yagi, K. Saito, A. Hirata, K. Kudo, M. Yano, T. Nagatsuma, K. Machida, and H. Kyuragi : “Microfabrication technology for high-speed Si-based systems”, Proc. Micromachining and Microfabrication SPIE, 4230, pp. 43-52, Singapore (2000)
2. INNOVATIVE INTEGRATION BASED ON SILICON-CORE TECHNOLOGIES FOR SENSOR AND COMMUNICATIONS APPLICATIONS
3. (4) K. Machida, S. Shigematsu, H. Morimura, N. Shimoyama, Y. Tanabe, T. Kumazaki, K. Kudou, M. Yano, and H. Kyuragi : “A new sensor structure and fabrication process for a single-chip fingerprint sensor/identifier LSI”, IEEE Int. Electron Devices Meet. Tech. Dig., pp. 887-890, Washington D. C., USA (1999)
4. (5) K. Saito, T. Kosugi, S. Yagi, C. Yamaghuchi, K. Kudo, M. Yano, T. Kumazaki, M. Yaita, H. Ishii, K. Machida, and H. Kyuragi : “A thick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric”, IEEE Int’l Interconnect Tech. Conf., pp. 123-125, San Francisco, USA (2000)
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