Conformal Coating of Organic Dielectric Film on Gold Electrodes in Microelectromechanical System Devices by Electrodeposition
Author:
Affiliation:
1. NTT Microsystem Integration Labs.
2. NTT Advanced Technology Corp.
Publisher
Institute of Electrical Engineers of Japan (IEE Japan)
Subject
Electrical and Electronic Engineering,Mechanical Engineering
Link
http://www.jstage.jst.go.jp/article/ieejsmas/127/4/127_4_253/_pdf
Reference9 articles.
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2. A methodology and model for the pull-in parameters of electrostatic actuators
3. (3) D. M. Tanner, J. A. Walraven, K. Helgesen, and L. W. Irwin : “MEMS Reliability in Shock Environments”, Proc. IEEE 38th Annual International Reliability Physics Symposium, pp. 129-138, San Jose, USA (2000)
4. (4) M. R. Houston, R. Maboudian, and R. T. Howe, Proc : “Self-assembled Monolayer Films as Durable Anti-Stiction Coating for Polysilicon Microstructures”, Proc. IEEE Solid-State Sensor and Actuator Workshop, pp. 42-47, Hilton Head, USA (1996)
5. Selective Electrodeposition Technology for Organic Insulator Films on Microelectromechanical-System Structures
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