Bonding Configuration and Electrical Properties of Carbon-Incorporated Low-Dielectric-Constant SiOC(-H) Films withNano-Pore Structures Deposited by Using PECVD-Reference-Cited by-同舟云学术

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Bonding Configuration and Electrical Properties of Carbon-Incorporated Low-Dielectric-Constant SiOC(-H) Films withNano-Pore Structures Deposited by Using PECVD

Published:2008-11-15 Issue:9(5) Volume:53 Page:2621-2626
ISSN:0374-4884
Container-title:Journal of the Korean Physical Society
language:en
Short-container-title:J. Korean Phy. Soc.

Author:

Kim ChangYoung,Jung AnSoo,Navamathavan R.,Choi ChiKyu,Woo Jong-Kwan

Publisher

Korean Physical Society

Subject

General Physics and Astronomy

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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