Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect
Author:
Funder
Pusan National University
Publisher
The Korean Welding and Joining Society
Link
http://e-jwj.org/upload/jwj-37-4-363.pdf
Reference14 articles.
1. SiC Die Attach for High-Temperature Applications
2. A Brief Review on High-Temperature, Pb-Free Die-Attach Materials
3. Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module
4. High-temperature electronics - a role for wide bandgap semiconductors?
5. Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures
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