Joint Property of Sn-Cu-Cr(Ca) Middle Temperature Solder for Automotive Electronic Module
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Publisher
The Korean Welding and Joining Society
Link
http://ocean.kisti.re.kr/downfile/crosscheck/kws/JAKO201333651559368.pdf
Reference5 articles.
1. Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
2. A Procedure for Automated Shape and Life Prediction in Flip-Chip and BGA Solder Joints
3. Alloy design of Zn–Al–Cu solder for ultra high temperatures
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1. Optimum Process Condition and Shear Strength of Transient Liquid Phase Bonded Cu/Sn/Ag and Ni/Sn/Ag Structures for Power Semiconductor Interconnect;Journal of Welding and Joining;2019-08-30
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