Physical Property of W-C-N Diffusion Barrier through Stress-Strain curve-Reference-Cited by-同舟云学术

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Physical Property of W-C-N Diffusion Barrier through Stress-Strain curve

Published:2011-07-30 Issue:4 Volume:20 Page:266-270
ISSN:1225-8822
Container-title:Journal of the Korean Vacuum Society
language:en
Short-container-title:Journal of the Korean Vacuum Society

Author:

Lee Kyu-Young,Kim Soo-In,Park Sang-Jae,Lee Dong-Kwan,Jeong Yong-Rok,Jung Jun,Lee Jong-Rim,Lee Chang-Woo

Publisher

The Korean Vacuum Society

Subject

Electrical and Electronic Engineering,Physical and Theoretical Chemistry,Condensed Matter Physics,Materials Science (miscellaneous)

Link

http://ocean.kisti.re.kr/downfile/crosscheck/kvs/JAKO201123163432956.pdf

Reference7 articles.

1. Characteristics of Electomigration & Surface Hardness about Tungsten-Carbon-Nitrogen(W-C-N) Related Diffusion Barrier

2. Additional Impurity Roles of Nitrogen and Carbon for Ternary compound W-C-N Diffusion Barrier for Cu interconnect

3. Characteristics and Physical Property of Tungsten(W) Related Diffusion Barrier Added Impurities

4. Analysis of Lattice constants change for study of W-C-N Diffusion

5. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments

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