Induction of Base Damages Representing a High Risk Site for Double-strand DNA Break Formation in Genomic DNA by Exposure of Cells to DNA Damaging Agents
Author:
Publisher
Elsevier BV
Subject
Cell Biology,Molecular Biology,Biochemistry
Reference62 articles.
1. The Chemical Basis of Radiation Biology;Sonntag,1989
2. DNA Damage Produced by Ionizing Radiation in Mammalian Cells: Identities, Mechanisms of Formation, and Reparability
3. Instability and decay of the primary structure of DNA
4. The Action ofEscherichia coliEndonuclease III on Multiply Damaged Sites in DNA
5. Reactivity of Human Apurinic/Apyrimidinic Endonuclease andEscherichia coli Exonuclease III with Bistranded Abasic Sites in DNA
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