Author:
Tian Yuxin,Xiong Bing,Sun Changzheng,Hao Zhibiao,Wang Jian,Wang Lai,Han Yanjun,Li Hongtao,Luo Yi
Abstract
Submounts with shunt capacitors are proposed to improve the RF power of flip-chip bonded photodiodes, demonstrating output power enhancement of 65% at 148 GHz, and flattened frequency response in F- and D-bands.
Cited by
2 articles.
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