Numerical-experimental study on the polishing of silicon wafers using coupled finite element-smoothed particle hydrodynamics
Author:
Publisher
The Optical Society
Subject
Atomic and Molecular Physics, and Optics,Engineering (miscellaneous),Electrical and Electronic Engineering
Reference21 articles.
1. Design of wafer-bonded structures for near room temperature Geiger-mode operation of germanium on silicon single-photon avalanche photodiode
2. Slip-free processing of (001) silicon wafers under 1064 nm laser ablation
3. High-speed combined NIR low-coherence interferometry for wafer metrology
4. GaN microring waveguide resonators bonded to silicon substrate by a two-step polymer process
5. Growth of Boron Carbide Nanostructures on Silicon Using Hot Filament Chemical Vapour Deposition
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1. Experimental Investigation into Double-disc and Chemically Assisted Magnetorheological Finishing Process;Silicon;2024-09-05
2. Thermal stress damage mechanism in single-crystal germanium caused by 1080 nm laser irradiation;Chinese Physics B;2023-10-01
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4. Machining of brittle materials: micro milling of glass;Journal of Mechanical Science and Technology;2021-08-28
5. The influence of ultrasonic vibrations on material removal in the silicon wafer polishing using DDCAMRF: Experimental investigations and process optimization;Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science;2021-08-18
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