Micromanipulation of InP lasers with optoelectronic tweezers for integration on a photonic platform-Reference-Cited by-同舟云学术

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Micromanipulation of InP lasers with optoelectronic tweezers for integration on a photonic platform

Published:2016-07-29 Issue:16 Volume:24 Page:18163
ISSN:1094-4087
Container-title:Optics Express
language:en
Short-container-title:Opt. Express

Author:

Juvert Joan,Zhang Shuailong,Eddie Iain,Mitchell Colin J.,Reed Graham T.,Wilkinson James S.,Kelly Anthony,Neale Steven L.

Funder

Engineering and Physical Sciences Research Council (EPSRC)

Royal Society

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics

Reference14 articles.

1. Heteroepitaxial technologies of III–V on Si

2. Plasma-assisted InP-to-Si low temperature wafer bonding

3. III-V/silicon photonics for on-chip and intra-chip optical interconnects

4. Electrically pumped 13 μm room-temperature InAs/GaAs quantum dot lasers on Si substrates by metal-mediated wafer bonding and layer transfer

5. Integration of Edge-Emitting Laser Diodes With Dielectric Waveguides on Silicon

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