Packaging of Silicon Photonics Systems-Reference-Cited by-同舟云学术

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Packaging of Silicon Photonics Systems

Published:2014 Issue: Volume: Page:
ISSN:
Container-title:Optical Fiber Communication Conference
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Author:

De Dobbelaere P.,Ayazi A.,Chi Y.,Dahl A.,Denton S.,Gloeckner S.,Hon Kam-Yan,Hovey S.,Liang Yi,Mack M.,Masini G.,Mekis A.,Peterson M.,Pinguet T.,Schramm J.,Sharp M.,Sohn C.,Stechschulte K.,Sun P.,Vastola G.,Verslegers L.,Zhou R.

Publisher

OSA

Reference2 articles.

1. A Grating-Coupler-Enabled CMOS Photonics Platform

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Packaging of Photonic Neural Network Accelerators;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Silicon photonic temperature sensor: from photonic integrated chip to fully packaged miniature probe;Journal of Optical Microsystems;2023-12-02

3. Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging;Journal of Infrared, Millimeter, and Terahertz Waves;2023-11-24

4. Packaging and Test of Photonic Integrated Circuits (PICs);Integrated Nanophotonics;2023-06-02

5. SiN-assisted Polymer-to-SiPh adiabatic coupler optimization;Optical Interconnects XIX;2019-03-04

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