Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging-Reference-Cited by-同舟云学术

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Terahertz Characterization of Glass-Based Materials and Stackups for 6 G Microelectronics Packaging

Published:2023-11-24 Issue:11-12 Volume:44 Page:841-857
ISSN:1866-6892
Container-title:Journal of Infrared, Millimeter, and Terahertz Waves
language:en
Short-container-title:J Infrared Milli Terahz Waves

Author:

Zhai Min,Bhaskar Pragna,Shi Haolian,Swaminathan Madhavan,Locquet Alexandre,Citrin D. S.

Funder

Conseil régional du Grand Est

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Instrumentation,Radiation

Link

https://link.springer.com/content/pdf/10.1007/s10762-023-00951-0.pdf

Reference46 articles.

1. Moses K Torkudzor, Stefan Schwarz, Jamal Deen Abdulai, and Markus Rupp. Energy efficiency, latency and reliability trade-offs in M2M uplink scheduling. IET Communications, 15(15):1907–1916, 2021.

2. John F O’Hara, Sabit Ekin, Wooyeol Choi, and Ickhyun Song. A perspective on terahertz next-generation wireless communications. Technologies, 7(2):43, 2019.

3. Seckin Sahin, Niru K Nahar, and Kubilay Sertel. Dielectric properties of low-loss polymers for mmW and THz applications. Journal of Infrared, Millimeter, and Terahertz Waves, 40(5):557–573, 2019.

4. T Chang, X Zhang, X Zhang, and H-L Cui. Accurate determination of dielectric permittivity of polymers from 75 GHz to 1.6 THz using both s-parameters and transmission spectroscopy. Applied Optics, 56(12):3287–3292, 2017.

5. F D’Angelo, Z Mics, M Bonn, and D Turchinovich. Ultra-broadband THz time-domain spectroscopy of common polymers using THz air photonics. Optics Express, 22:12475–12485, 2014.

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