Towards industrial ultrafast laser microwelding: SiO_2 and BK7 to aluminum alloy-Reference-Cited by-同舟云学术

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Towards industrial ultrafast laser microwelding: SiO_2 and BK7 to aluminum alloy

Published:2017-06-01 Issue:16 Volume:56 Page:4873
ISSN:0003-6935
Container-title:Applied Optics
language:en
Short-container-title:Appl. Opt.

Author:

Carter Richard M.,Troughton Michael,Chen Jianyong,Elder Ian,Thomson Robert R.,Daniel Esser M. J.,Lamb Robert A.,Hand Duncan P.

Funder

Engineering and Physical Sciences Research Council (EPSRC)

Science and Technology Facilities Council (STFC)

Publisher

The Optical Society

Reference29 articles.

1. Adhesive wafer bonding

2. Sealing of adhesive bonded devices on wafer level

3. Localized laser assisted eutectic bonding of quartz and silicon by Nd:YAG pulsed-laser

4. Localised laser joining of glass to silicon with BCB intermediate layer

5. Ultrashort pulsed fiber laser welding and sealing of transparent materials

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