Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors-Reference-Cited by-同舟云学术

Silicon photonics fiber-to-the-home transceiver array based on transfer-printing-based integration of III-V photodetectors

Published:2017-06-13 Issue:13 Volume:25 Page:14290
ISSN:1094-4087
Container-title:Optics Express
language:en
Short-container-title:Opt. Express

Author:

Zhang Jing,De Groote Andreas,Abbasi Amin,Loi Ruggero^ORCID,O’Callaghan James,Corbett Brian,Trindade António José,Bower Christopher A.,Roelkens Gunther

Publisher

The Optical Society

Subject

Atomic and Molecular Physics, and Optics

Reference11 articles.

1. Widely Tunable Narrow-Linewidth Monolithically Integrated External-Cavity Semiconductor Lasers

2. InAs/GaAs Quantum Dot Lasers on Silicon-on-Insulator Substrates by Metal-Stripe Wafer Bonding

3. Ultra-thin DVS-BCB adhesive bonding of III-V wafers, dies and multiple dies to a patterned silicon-on-insulator substrate

4. A printable form of silicon for high performance thin film transistors on plastic substrates

Cited by 45 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silicon-Nanowire-Based 100-GHz-Spaced 16λ DWDM, 800-GHz-Spaced 8λ LR-8, and 20-nm-Spaced 4λ CWDM Optical Demultiplexers for High-Density Interconnects in Datacenters;Photonics;2024-04-05

2. Hybrid material integration for active photonic applications;APL Photonics;2024-03-01

3. Selective 1.3 μm Laser Emission via Coupled Microlaser for Laser Resonance Tuning;ACS Photonics;2024-02-13

4. Micro-transfer printing of thick optical components using a tether-free UV-curable approach;Journal of Optical Microsystems;2023-11-29

5. 100 Gbps PAM4 ultra-thin photodetectors integrated on SOI platform by micro transfer printing;Optics Express;2023-10-13