Separation of Sn, Bi, Cu from Pb-free solder paste by ammonia leaching followed by hydrochloric acid leaching
Author:
Funder
Ministry of Environment
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Industrial and Manufacturing Engineering
Reference16 articles.
1. Selective Leaching for the Recovery of Copper from PCB. Proceed. Malaysian Metallurgical Conference ‘09 (MMC09);Bari,2009
2. The effects of temperature and agitation speed on the leaching behaviors of tin and bismuth spent lead free solder in nitric acid leach solution;Jeon;Geosystem Eng.,2015
3. Separation of tin, silver and copper from waste Pb-free solder using hydrochloric acid leaching with hydrogen peroxide;Kim;Mater. Trans.,2014
4. Recent applications of bioelectrochemical system for useful resource recovery: retrieval of nutrient and metal from wastewater;Kim;Geosystem Eng.,2015
5. Leaching of tin from waste Pb-free solder in hydrochloric acid solution with stannic chloride;Kim;Hydrometallurgy,2016
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