Stability and electronic structure of intrinsic and intercalated copper nitride alloys
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,General Chemistry
Reference30 articles.
1. Kupferpalladiumnitride, Cu3PdxN mit x = 0,020 und 0,989, Perowskite mit “bindender 3d10-4d10-Wechselwirkung”
2. Electronic structure and chemical-bonding mechanism ofCu3N,Cui3NPd, and related Cu(I) compounds
3. Magnetic instability within the seriesTCu3N(T=Pd, Rh, and Ru): A first-principles study
4. First-principles calculations of the structural and electronic properties of Cu3MN compounds with M=Ni, Cu, Zn, Pd, Ag, and Cd
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1. Mechanical properties of cubic Cu3N and Cu4N: A theoretical investigation;Vacuum;2021-09
2. Preparation, structure, properties, and application of copper nitride (Cu 3 N) thin films: A review;Journal of Materials Science & Technology;2018-09
3. A theoretical investigation of structural, electronic and optical properties of bulk copper nitrides;Journal of Alloys and Compounds;2018-07
4. Synthesis and characterization of Cu3N nanoparticles using pyrrole-2-carbaldpropyliminato Cu(ii) complex and Cu(NO3)2 as single-source precursors: the search for an ideal precursor;New Journal of Chemistry;2018
5. Epitaxial CuN Films with Highly Tunable Lattice Constant for Lattice-Matched Magnetic Heterostructures with Enhanced Thermal Stability;Advanced Electronic Materials;2017-12-04
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