A theoretical investigation of structural, electronic and optical properties of bulk copper nitrides
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference87 articles.
1. Kupfernitrid Metallamide und Metallnitride. VII
2. Electronic structure and chemical-bonding mechanism ofCu3N,Cui3NPd, and related Cu(I) compounds
3. Growth of stoichiometric Cu3N thin films by reactive magnetron sputtering
4. Electrical conductivity and photoreflectance of nanocrystalline copper nitride thin films deposited at low temperature
5. Stability and electronic structure of intrinsic and intercalated copper nitride alloys
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3. Development and application of interatomic potentials to study the stability and shear strength of Ti/TiN and Cu/TiN interfaces;Materials & Design;2020-11
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