Mode II cohesive zone law of porous sintered silver joints with nickel coated multiwall carbon nanotube additive under ENF test-Reference-Cited by-同舟云学术

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Mode II cohesive zone law of porous sintered silver joints with nickel coated multiwall carbon nanotube additive under ENF test

Published:2022-10 Issue: Volume:121 Page:103498
ISSN:0167-8442
Container-title:Theoretical and Applied Fracture Mechanics
language:en
Short-container-title:Theoretical and Applied Fracture Mechanics

Author:

Dai Yanwei,Zan Zhi,Zhao Shuai,Qin Fei

Funder

National Natural Science Foundation of China

Beijing Municipal Commission of Education

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Condensed Matter Physics,General Materials Science

Reference51 articles.

1. Identifying the development state of sintered silver (Ag) as a bonding material in the microelectronic packaging via a patent landscape study;Siow;J. Electron. Packaging.,2016

2. Ageing sintered silver: relationship between tensile behavior, mechanical properties and the nanoporous structure evolution;Gadaud;Mat. Sci. Eng. A,2016

3. Strain rate sensitivity of sintered silver nanoparticles using rate-jump indentation;Long;Int. J. Mech. Sci.,2018

4. T. Herboth, M. Guenther, A. Fix, J. Wilde, Failure mechanisms of sintered silver interconnections for power electronic applications, in: 2013 IEEE 63rd electronic components and technology conference (2013) 1621-1627.

5. Macroscale and microscale fracture toughness of microporous sintered Ag for applications in power electronic devices;Chen;Acta Mater.,2017

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recurrent neural network (RNN) and long short-term memory neural network (LSTM) based data-driven methods for identifying cohesive zone law parameters of nickel-modified carbon nanotube reinforced sintered nano-silver adhesives;Materials Today Communications;2024-06

2. Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube;Materials Science in Semiconductor Processing;2024-05

3. Investigation of traction-separation behavior in adhesively bonded joints under mode I and mode II loading using DIC technique and FEA;Engineering Failure Analysis;2024-05

4. Microscopic fracture toughness of notched porous sintered Cu micro-cantilevers for power electronics packaging;Materials Science and Engineering: A;2024-04

5. Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler;Journal of Electronic Materials;2023-12-21

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