1. Multichip Module Technologies and Alternatives;Doane,1993
2. Estes R H 1997 Flip-chip packaging with polymer bumps. Semicond. Int. (Feb.), 103–8
3. Geometric optimization of controlled collapse interconnects;Goldman;IBM J. Res. Dev.,1969
4. Chip on Board Technologies for Multichip Modules,1994
5. Flip Chip Technologies,1995