Development of a solder paste with ultrafine conditioned powder for the active brazing of ceramics-Reference-Cited by-同舟云学术

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Development of a solder paste with ultrafine conditioned powder for the active brazing of ceramics

Published:2005-04 Issue:1-2 Volume:396 Page:41-49
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Rosenbaum C.,Aubertin F.,Breme J.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference28 articles.

1. Binary Alloy Phase Diagrams;Massalski,1990

2. The wetting of alumina by copper alloyed with titanium and other elements

3. Joining of Cermics, Glass and Metals, DGM, Oberursel;Nicholas,1989

4. Thermochemical Data of Pure Substances;Barn,1989

5. Introduction to Solid State Physics;Kittel,1976

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Induction brazing of Al2O3 ceramic and 316L stainless steel with Sn–Ti filler alloy;Ceramics International;2023-09

2. Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods;Journal of Electronic Materials;2019-02-06

3. Joining of SiO2f/SiO2 composite to Al2O3 ceramic using AgCu-Ti brazing filler metal;Welding in the World;2016-11-09

4. Al2O3/SUS304 Brazing via AgCuTi-W Composite as Active Filler;Journal of Materials Engineering and Performance;2013-12-27

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