Author:
Su Cherng-Yuh,Zhuang Xie-Zongyang,Pan Cheng-Tang
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference25 articles.
1. M. Kaji, M.E. Stevenson, and R.C. Bradt, Knoop Micro-Hardness Anisotropy and THE Indentation Size Effect on the Basal Plane of Single-Crystal Alumina (Sapphire), J. Am. Ceram. Soc., 2002, 85(2), p 415–422
2. G.J. Yang, Composite Solder Joints Brazed Al203 Ceramic Microstructure and Residual Stress Studies, Harbin Engineering University, China, 2003
3. R.W. Smith, Active Solder Joining of Metal/Ceramics and Composites, Weld. J., 2001, 80(10), p 30–35
4. H. Hongqi, W. Yonglan, J. Zhihao, and W. Xiaotian, Interfacial Reaction of Alumina with Ag-Cu-Ti Alloy, J. Mater. Sci., 1995, 30(5), p 1233–1239
5. C. Rosenbaum, F. Aubertin, and J. Breme, Development of a Solder Paste with Ultrafine Conditioned Powder for the Active Brazing of Ceramics, Mater. Sci. Eng., A, 2005, 396(1-2), p 41–49
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