Investigation on the microstructure, mechanical and electrical properties of Ti3SiC2/Cu joint obtained by Ti25Zr25Ni25Cu25 amorphous high entropy alloy and Ag composite filler-Reference-Cited by-同舟云学术

Investigation on the microstructure, mechanical and electrical properties of Ti3SiC2/Cu joint obtained by Ti25Zr25Ni25Cu25 amorphous high entropy alloy and Ag composite filler

Published:2023-06 Issue: Volume:877 Page:145190
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Nai Xin,Chen Haiyan,Zhao Shuai,Kong Xiangwei,Wang Qian,Wang Pengcheng,Li Wenya^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference40 articles.

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2. Designing a low-melting Sn6Ag7Ni4Co2Ti high entropy alloy filler to optimize microstructure and mechanical properties of Ti3SiC2/Cu joint;Nai;Mater. Char.,2023

3. Joining Ti3SiC2 MAX phase with 308 stainless steel and aluminum fillers by tungsten inert gas (TIG)-brazing process;Hadji;Ceram. Int.,2016

4. Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer;Cheng;Ceram. Int.,2022

5. Interfacial study of NiTi–Ti3SiC2 solid state diffusion bonded joints;Kothalkar;Mater. Sci. Eng., A,2015

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