Influence of Ti3SiC2 content on erosion behavior of Cu–Ti3SiC2 cathode under vacuum arc
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Surfaces, Coatings and Films,Process Chemistry and Technology,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. Advances in material development for high power, vacuum interrupter contacts;Slade;IEEE Trans. Compon. Packag. Manuf. Technol.,1994
2. In situ synthesis and electrical properties of CuW–La2O3 composites;Qian;Int. J. Refract. Metals Hard Mater.,2012
3. Effect of Fe on vacuum breakdown properties of CuW alloys;Cao;Int. J. Refract. Metals Hard Mater.,2011
4. Electrical wear of TiB2 particle-reinforced Cu and Cu–Cr composites prepared by vacuum arc melting;Feng;Vacuum,2020
5. Effect of Mo addition on microstructure and vacuum arc characteristics of CuCr50 alloy;Weichan;Vacuum,2011
Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Unveiling solid-state transformation toughening mechanism of yttria stabilized zirconia on brazed joint by in-situ observation;Journal of Manufacturing Processes;2024-10
2. Erosion behaviors and mechanisms of Ti3AlC2 material under arc discharge in various mixed atmospheres;Ceramics International;2024-09
3. Electrochemical Corrosion Behavior and the Related Mechanism of Ti3SiC2/Cu Composites in a Strong Acid Environment;Materials;2024-08-14
4. The anti‐oxidation behavior of the Ti3SiC2/Cu composites at high temperatures;International Journal of Applied Ceramic Technology;2024-07-18
5. Arc erosion behavior and mechanism of Cu/Ti3SiC2 composites in air and c-C4F8/N2 mixture after multiple arc discharges;Ceramics International;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3