Evidence for the intergranular segregation of tin to grain boundaries of a Cu–Sn alloy and its consequences for dynamic embrittlement
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference8 articles.
1. The effect of tin on the susceptibility of a Cu–Al alloy to cracking in mercury
2. Quasi-static intergranular cracking in a Cu/1bSn alloy; an analog of stress relief cracking of steels
3. Tin-induced dynamic embrittlement of Cu–7% Sn bicrystals with a Σ5 boundary
4. Dynamic embrittlement of Cu–Sn bicrystals grown from the melt
5. On the suppression of dynamic embrittlement in Cu–8wt%Sn by an addition of zirconium
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4. The effect of solute segregation on stability and strength of Cu symmetrical tilt grain boundaries from the first-principles study;Journal of Materials Research and Technology;2022-11
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