Dynamic embrittlement of Cu–Sn bicrystals grown from the melt
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference9 articles.
1. Quasi-static intergranular cracking in a Cu/1bSn alloy; an analog of stress relief cracking of steels
2. Dynamic embrittlement of boron-doped Ni3Al alloys at 600°C
3. Sulfur-induced dynamic embrittlement in a low-alloy steel
4. Mechanisms of stress relief cracking in a ferritic steel
5. Tin-induced dynamic embrittlement of Cu–7% Sn bicrystals with a Σ5 boundary
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn–Cu “bimetal ledge specimen”;Journal of Materials Research;2009-12
2. Intermediate temperature embrittlement of copper alloys;International Materials Reviews;2009-03
3. Evidence for the intergranular segregation of tin to grain boundaries of a Cu–Sn alloy and its consequences for dynamic embrittlement;Materials Science and Engineering: A;2007-06
4. Thermodynamic and kinetic aspects of interfacial decohesion;Acta Materialia;2002-08
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