Formation of a dislocation back stress during creep of copper at low temperatures-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Formation of a dislocation back stress during creep of copper at low temperatures

Published:2017-07 Issue: Volume:700 Page:622-630
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Sandström Rolf

Funder

Swedish Nuclear Fuel and Waste Management Co (SKB)

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference32 articles.

1. ASM Handbook Volume 02: Properties and Selection: Nonferrous Alloys and Special-PurposeMaterials, ASM, 1991, ASM, 1991.

2. High-temperature creep of copper;Feltham;Acta Metall.,1972

3. Creep behavior of copper at intermediate temperatures—I. Mechanical characteristics;Raj;Acta Metall.,1989

4. Creep of copper in the temperature range 423–623 K;Chandler;Mater. Sci. Eng.: A,1993

5. Constant structure creep of copper at 973K;Broyles;Scr. Metall. Et. Mater.,1995

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Cells and Subgrains. The Role of Cold Work;Springer Series in Materials Science;2024

2. Tertiary Creep;Springer Series in Materials Science;2024

3. Basic Modelling of General Strength and Creep Properties of Alloys;Crystals;2023-12-25

4. Basic Analytical Modeling of Creep Strain Curves;Materials;2023-05-05

5. Primary creep at low stresses in copper;Materials Science and Engineering: A;2023-05

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP