Fatigue fracture mechanisms of Cu/lead-free solders interfaces
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference36 articles.
1. IPC Roadmap: A Guide for Assembly of Lead-free Electronics, Draft IV, 2000.
2. Lead (Pb)-free solders for electronic packaging
3. Lead-free Solders in Microelectronics
4. Rate of consumption of Cu in soldering accompanied by ripening
5. Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders
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