Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Anomalous multiple pop-in behavior in Cu–Sn-based intermetallic compounds during nanoindentation

Published:2014-08 Issue: Volume:612 Page:192-196
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Jun Hoin,Kim Yiseol,Lee Sangjun,Kang Namhyun,Kim Kyoung-Bo,Kim Moojin,Hyung Kim Soo,Lee Dongyun^ORCID

Funder

Ministry of Education

Ministry of Knowledge Economy

Ministry of Science, ICT & Future Planning

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference29 articles.

1. Characterization of integrated circuit aluminium bonding pads by nanoindentation and scanning force microscopy

2. Effect of Copper TSV Annealing on Via Protrusion for TSV Wafer Fabrication

3. A different type of indentation size effect

4. Nanoindentation-induced defect–interface interactions: phenomena, methods and limitations

5. Modeling dislocation—grain boundary interactions through gradient plasticity and nanoindentation

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics;Materials Science and Engineering: A;2023-08

2. Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer;Journal of Alloys and Compounds;2022-12

3. Indentation-induced cracking behavior of a Cu(In,Ga)Se2 films on Mo substrate;Journal of Materials Research and Technology;2021-07

4. Phase selection and nano-mechanical properties of intermetallic compounds in directionally solidified Cu-68at.%Sn peritectic alloy;Journal of Alloys and Compounds;2021-04

5. Mechanical Properties of U-Cu Intermetallic Compound Measured by Nanoindentation;Materials;2018-11-08

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3