Fatigue life and plastic deformation behavior of electrodeposited copper thin films
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference36 articles.
1. A new method for tensile testing of thin films
2. Tensile and fracture behavior of free-standing copper films
3. A new technique for measuring the mechanical properties of thin films
4. Tensile testing of microfabricated thin films
5. Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
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