Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference43 articles.
1. Size effects in materials due to microstructural and dimensional constraints: a comparative review
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5. Nanoindentation study of the mechanical properties of copper‐nickel multilayered thin films
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