Effect of compositional undulation on the mechanical behavior of atomic-scale planar-faulted Ni-Mo-W films-Reference-Cited by-同舟云学术

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Effect of compositional undulation on the mechanical behavior of atomic-scale planar-faulted Ni-Mo-W films

Published:2024-11 Issue: Volume:915 Page:147250
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Park Yuhyun^ORCID,Choi Sunkun,Ryou KenHee,Park JungHun,Choi Won Seok,Ko Won-Seok,Choi Pyuck-Pa,Sim Gi-Dong^ORCID

Funder

KAIST

NRF

Publisher

Elsevier BV

Reference74 articles.

1. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004

2. Thermal stability of sputtered Cu films with nanoscale growth twins;Anderoglu;J. Appl. Phys.,2008

3. Revealing the maximum strength in nanotwinned copper;Lu;Science,2009

4. Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning;Zhang;Acta Mater.,2004

5. Ultrastrong nanotwinned pure nickel with extremely fine twin thickness;Duan;Sci. Adv.,2021

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