Microcreep of rapidly solidified Sn–0.7wt.% Cu–In solder alloys
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference9 articles.
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3. The relation between valency, axial ratio, Young’s modulus and resistivity of rapidly solidified tin-based eutectic alloys
4. Science of Materials;Geller,1977
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1. Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints;Journal of Materials Science: Materials in Electronics;2024-03
2. Structural, thermal and mechanical properties of rapidly solidified Bi-0.5Ag lead-free solder reinforced Tb rare-earth element for high performance applications;Soldering & Surface Mount Technology;2024-02-09
3. Cu-In-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2022-04-27
4. Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder;Arab Journal of Nuclear Sciences and Applications;2019-04-17
5. Nickel effects on the structural and some physical properties of the eutectic Sn-Ag lead-free solder alloy;Soldering & Surface Mount Technology;2019-02-18
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