Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy-Reference-Cited by-同舟云学术

Effect of rapid solidification and small additions of Zn and Bi on the structure and properties of Sn-Cu eutectic alloy

Published:2005-02 Issue:2 Volume:34 Page:212-215
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

El-Ashram Tarek,Shalaby R. M.

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-005-0234-y.pdf

Reference7 articles.

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3. M. McCormack, G.W. Kammlott, and H.S. Chen, J. Appl. Phys. Lett. 65 (1994).

4. Yu.A. Geller and A.G. Rakhshtadt, Science of Materals (Moscow: Mir Publishers, 1977), pp. 138–141.

5. Selected Powder Diffraction Data for Education & Training, Search Manual and Data Cards, JCPDS, International Center For Diffraction Data, William Frank McClune, Editor-in-Chief, Swarthmore, PA, JCPDS, 1988.

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