Shear punch creep behavior of cast lead-free solders
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Creep deformation characteristics of tin and tin-based electronic solder alloys
2. Lead-free Solders in Microelectronics
3. Power law indentation creep of Sn-5% Sb solder alloy
4. Improved mechanical properties in new, Pb-free solder alloys
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1. Interfacial reactions in electrodeposited Cu-Bi-Sn multilayers;Journal of Materials Science: Materials in Electronics;2023-09
2. Microstructural evolution and impression creep properties of a lead-based alloy PbSn16Sb16Cu2;Materials Testing;2022-05-01
3. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review;Journal of Materials Science: Materials in Electronics;2021-12-01
4. Numerical and experimental analysis of creep deformation and stress-relaxation in Sn-5Sb lead-free alloy;Engineering Failure Analysis;2021-02
5. Evaluation of creep properties for aged Pb-free solder joints/(Ni-P/Au) UBM with small addition Cu using shear punch creep testing method;Engineering Failure Analysis;2020-07
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