Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure-Reference-Cited by-同舟云学术

Multi-scale modeling of elasto-plastic response of SnAgCu lead-free solder alloys at different ageing conditions: Effect of microstructure evolution, particle size effects and interfacial failure

Published:2016-04 Issue: Volume:661 Page:132-144
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Maleki Milad,Cugnoni Joel,Botsis John

Funder

Swiss Secretariat for Education and Research

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference55 articles.

1. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

2. Mechanical and microstructural properties of SnAgCu solder joints

3. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

4. The development of the COST 531 lead-free solders thermodynamic database

5. On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints

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