Microstructure–property relationship in highly ductile Au–Cu thin films for flexible electronics
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference47 articles.
1. Tensile and fracture behavior of free-standing copper films
2. High ductility of a metal film adherent on a polymer substrate
3. Metal films on polymer substrates stretched beyond 50%
4. Delocalizing strain in a thin metal film on a polymer substrate
5. An examination of the constitutive equation for elevated temperature plasticity
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