Reactive diffusion between Pd and Sn at solid-state temperatures
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference23 articles.
1. Interdiffusion and reaction in bimetallic Cu-Sn thin films
2. Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films
3. Soldering external connections to thin film systems
4. Effects of intermetallic formation at the interface between copper and lead-tin solder
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