Deformation mechanisms in FCC Co dominated by high-density stacking faults-Reference-Cited by-同舟云学术

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Deformation mechanisms in FCC Co dominated by high-density stacking faults

Published:2018-10 Issue: Volume:736 Page:12-21
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Su R.,Neffati D.,Xue S.,Li Q.,Fan Z.,Liu Y.,Wang H.,Kulkarni Y.,Zhang X.^ORCID

Funder

NSF-DMR

DOE-BES

U.S. Office of Naval Research

Life Sciences Microscopy Center and Materials Science Microscopy Center at Purdue University

Center of Advanced Computing and Data Systems at the University of Houston

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference88 articles.

1. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004

2. Effects of deposition parameters on residual stresses, hardness and electrical resistivity of nanoscale twinned 330 stainless steel thin films;Zhang;J. Appl. Phys.,2005

3. High-strength sputter-deposited Cu foils with preferred orientation of nanoscale growth twins;Zhang;Appl. Phys. Lett.,2006

4. Work hardening of ultrafine-grained copper with nanoscale twins;Chen;Scr. Mater.,2007

5. A nucleation mechanism of deformation twins in pure aluminum;Li;Acta Mater.,2009

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