Excellent mechanical properties and high electrical conductivity of Cu-Co-Si-Ti alloy due to multiple strengthening-Reference-Cited by-同舟云学术

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Excellent mechanical properties and high electrical conductivity of Cu-Co-Si-Ti alloy due to multiple strengthening

Published:2021-07 Issue: Volume:821 Page:141639
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Geng Yongfeng,Ban Yijie,Li Xu,Zhang Yi,Jia Yanlin,Tian Baohong,Zhou Meng,Liu Yong,Volinsky Alex A.,Song Kexing,Tang Shunlong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference48 articles.

1. A review of microstructure and texture evolution with nanoscale precipitates for copper alloys;Geng;J. Mater. Res. Technol.,2020

2. The crystallographic and morphological evolution of the strengthening precipitates in Cu-Ni-Si alloys;Hu;Acta Mater.,2013

3. Effects of Cr addition on the constitutive equation and precipitated phases of copper alloy during hot deformation;Ban;Mater. Des.,2020

4. Formation of nanostructure and abnormal annealing behavior of a Cu-Ag-Zr alloy processed by high-pressure torsion;Tian;Mater. Sci. Eng., A,2013

5. The effect of Co addition on the modulated structure coarsening and discontinuous precipitation growth kinetics of Cu-15Ni-8Sn alloy;Guo;J. Alloys Compd.,2020

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1. Simultaneously Enhanced Hardness and Electrical Conductivity in a Cu-Co-Si Alloy by Optimizing Solid Solution Treatment;Journal of Materials Engineering and Performance;2024-08-19

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3. Effect of Calefaction and Stress Relaxation on Grain Boundaries/Textures of Cu–Cr–Ni Alloy;Metals;2024-07-22

4. Precipitation behavior and properties change of Cu–3Ti–2Ni alloy during aging process;Materials Science and Engineering: A;2024-05

5. Effects of Trace La on the Aging Properties of the Cu-Ti-Zr Alloys;Journal of Materials Engineering and Performance;2024-04-17

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