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Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

  • Published:2004-05 Issue:9-10 Volume:41 Page:2743-2755
  • ISSN:0020-7683
  • Container-title:International Journal of Solids and Structures
  • language:en
  • Short-container-title:International Journal of Solids and Structures

Author:

Ye Hua,Basaran Cemal,Hopkins Douglas C.

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Reference39 articles.

1. Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations;Basaran;Applied Mathematical Modelling,1998

2. Basaran, C., Tang, H., 2001. Computer simulations of solder joint reliability tests. Advanced Packaging Magazine

3. Brandenburg, S., Yeh, S., 1998. Electromigration studies of flip chip bump solder joints. Surface Mount International Conference Proceedings

4. Progress in Metal Physics, vol. 3;Burke,1952

5. Analysis of calorimetric measurements of grain growth;Chen;Journal of Applied Physics,1991

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